Three-Dimensional Molded Interconnect Devices (3D-MID)
نویسنده
چکیده
منابع مشابه
A Multilayer Process for 3D-Molded-Interconnect-Devices to Enable the Assembly of Area-Array Based Package Types
Three-dimensional molded interconnected devices (3D-MID) extend the range of classical printed circuit boards (PCB) to the third dimension. Electrical circuits can be routed over any surface forms. This enables innovative applications and new design possibilities. The combination of circuit carrier, housing, and further functions results in an increased density of integration with decreased pro...
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